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IC Substrate

2024-01-24 Company News / News / Notification / Trade News

What is IC Substrate? IC Substrate,IC Substrate (Integrated Circuit Substrate) is a crucial component in electronic devices for mounting and connecting integrated circuits (ICs). It provides a platform for chips to interface with Printed Circuit Boards (PCBs). Typically composed of multiple layers of thin films including insulation, metal, and conductor…

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BGA Substrate

2024-01-23 Company News / News / Notification / Trade News

What is BGA Substrate? BGA Substrate,BGA Substrate (Ball Grid Array Substrate) is a crucial component for integrated circuit packaging, designed with an array of balls. This packaging technology utilizes solder balls to connect the chip to the Printed Circuit Board (PCB), enabling high-density connections and reliable electrical links. Typically composed…

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ABF Substrate

2024-01-22 Company News / News / Notification / Trade News

What is ABF Substrate? ABF Substrate,ABF Substrate (Anisotropic Conductive Film Substrate) is a critical component for integrated circuit packaging, featuring anisotropic conductive film properties. It provides electrical connections in both vertical and horizontal directions via fine conductive particles, enabling high-density, high-performance packaging. Typically composed of multiple layers of thin films…

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FCBGA Packaging

2024-01-19 Company News / News / Notification / Trade News

What Is FCBGA Packaging? FCBGA Packaging,FCBGA Packaging (Fine-pitch Ball Grid Array) revolutionizes integrated circuit packaging with its fine-pitch solder ball array, enabling high-density connections. This innovative packaging technique enhances signal transmission efficiency and power delivery, crucial for advanced electronics. FCBGA Packaging incorporates multiple layers including insulating, metal, and conductor layers,…

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FCBGA Package

2024-01-18 Company News / News / Notification / Trade News

What is FCBGA Package? FCBGA Package,FCBGA Package (Fine-pitch Ball Grid Array) is an advanced integrated circuit packaging technology, featuring a fine-pitch array of solder balls for high-density connections. This packaging solution facilitates direct chip-to-board connections, optimizing signal transmission and power distribution. FCBGA Packages are constructed with multiple layers including insulating,…

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FCBGA Substrates

2024-01-17 Company News / News / Notification / Trade News

What are FCBGA Substrates? FCBGA Substrates,FCBGA Substrates (Fine-pitch Ball Grid Array) are advanced packaging solutions for integrated circuits, facilitating high-density connections and efficient signal transmission. Utilizing a fine-pitch array of solder balls, FCBGA Substrates enable direct chip-to-board connections, enhancing performance and reliability in electronic devices. Composed of multiple layers including…

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