Technology  Contact    |    

We are a professional supplier of high frequency circuit boards, high frequency packaging substrates, ultra-small pitch, ultra-thin high frequency materials, and fast delivery.

About us

High frequency/high speed PCB manufacturers

ALCANTA Technology (Shenzhen) Co., Ltd. specializes in the production of high frequency circuit board, high frequency BGA package substrate, CAVITY high frequency/high speed circuit board, or other kinds of material circuit board or BGA package substrate, such as: high speed circuit board, high speed BGA package substrate, ceramic substrate, ceramic BGA package substrate, soft and hard combined BGA package substrate. We have many kinds of materials, such as Rogers series materials, Isola series materials, BT series materials, Ajinomoto(ABF) series materials, Showa Denko series materials, or other kinds of materials, and so on.
We have a team of technical experts and engineers with packaging substrate production equipment with ultra-small spacing (12um/12um,trace/spacing), and over 90% of our high precision production equipment is imported from Japan. We produce circuit boards, or BGA packaging substrates with stable quality, fast delivery and relatively low price.

ALCANTA's manufacturing capabilities cover the production of high frequency PCBS from double layer to multi-layer and high frequency BGA package substrates and high speed BGA package substrates (4 to 20 layers). If you have some questions about the process capability when designing such products, or if you are not sure whether your design factory can produce them, please contact us and we will reply you with relevant design data at any time.
As for the design details, some major details can be provided here. For the high-frequency board, we can produce a minimum of 30um trace width, 30um pitch, and the smallest BGA Bump pitch is 100um. We use Msap and SAP technology. The minimum blind hole/buried hole diameter is 50um, the thinnest double-sided substrate thickness is about 0.1MM, for high-speed package substrate, we can produce a minimum 12um trace width, 12um spacing, and the smallest BGA Bump pitch is 100um. We look forward to working with you to create a better future of science and technology.

Why Choose Us

  • Professional & Qualified

    Professional

    Our main product types, ultra-thin PCB, ultra-small trace, ultra-small Pitch, we can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 to 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 months

  • DEDICATED TEAM

    Dedicated Team

    We have a vast team with over 10,000 dedicated employees, including more than 200 senior engineers, focused on addressing your technical and design challenges.

  • Quality Materials

    Quality Equipment

    More than 90% of our high-precision equipment is imported from Japan, our equipment is mainly used for the production of 4 to 20 layers of FC BGA packaging substrates, high-precision equipment makes our products have smaller tolerances, and the materials we use are genuine materials, such as Rogers, BT, ABF, ISOLA, high TG FR4

  • Customer Support

    Customer Support

    In the process of developing a new product, if you have concerns about the feasibility of the manufacturing process or are worried about whether the production manufacturer can smoothly meet your design requirements, please do not hesitate to contact us. We are ready at any time to address your concerns and welcome your emails.

Sales Network

What sets us apart from the competition? Our ability to listen to our customers!

Our goal of achieving 100% customer satisfaction has transformed us from a single-product company into a progressive company with a variety of world-class, high-quality FC-BGA (Flip Chip Ball Grid Array) boards used in servers, artificial intelligence, networking, communications, military, industrial, aerospace, and other industries. Our technology and products span multiple critical areas, supporting various industries in meeting the demands of modern electronic devices for high density, high performance, and high reliability.

Every month, we welcome approximately 100 to 200 new customers from around the world. Some discover us through online channels, while others are referred by existing customers. Our customer base extends to several countries

Send Your Inquiry






    Leave a message