High frequency/high speed PCB manufacturers
ALCANTA Technology (Shenzhen) Co., Ltd. specializes in the production of high frequency circuit board, high frequency BGA package substrate, CAVITY high frequency/high speed circuit board, or other kinds of material circuit board or BGA package substrate, such as: high speed circuit board, high speed BGA package substrate, ceramic substrate, ceramic BGA package substrate, soft and hard combined BGA package substrate. We have many kinds of materials, such as Rogers series materials, Isola series materials, BT series materials, Ajinomoto(ABF) series materials, Showa Denko series materials, or other kinds of materials, and so on.
We have a team of technical experts and engineers with packaging substrate production equipment with ultra-small spacing (12um/12um,trace/spacing), and over 90% of our high precision production equipment is imported from Japan. We produce circuit boards, or BGA packaging substrates with stable quality, fast delivery and relatively low price.
ALCANTA's manufacturing capabilities cover the production of high frequency PCBS from double layer to multi-layer and high frequency BGA package substrates and high speed BGA package substrates (4 to 20 layers). If you have some questions about the process capability when designing such products, or if you are not sure whether your design factory can produce them, please contact us and we will reply you with relevant design data at any time.
As for the design details, some major details can be provided here. For the high-frequency board, we can produce a minimum of 30um trace width, 30um pitch, and the smallest BGA Bump pitch is 100um. We use Msap and SAP technology. The minimum blind hole/buried hole diameter is 50um, the thinnest double-sided substrate thickness is about 0.1MM, for high-speed package substrate, we can produce a minimum 12um trace width, 12um spacing, and the smallest BGA Bump pitch is 100um. We look forward to working with you to create a better future of science and technology.
