Tel: +086 0755 85241496 E-mail: sales@alcantapcb.com

Technology Contact |

TradeNews-Page40of246-Professionalhighfrequencycircuitboardsupplier-Page40

Trade News

Home

Trade News

IC Substrate

2024-01-24 Company News / News / Notification / Trade News

What is IC Substrate? IC Substrate,IC Substrate (Integrated Circuit Substrate) is a crucial component in electronic devices for mounting and connecting integrated circuits (ICs). It provides a platform for chips to interface with Printed Circuit Boards (PCBs). Typically composed of multiple layers of thin films including insulation, metal, and conductor…

Read more
BGA Substrate

2024-01-23 Company News / News / Notification / Trade News

What is BGA Substrate? BGA Substrate,BGA Substrate (Ball Grid Array Substrate) is a crucial component for integrated circuit packaging, designed with an array of balls. This packaging technology utilizes solder balls to connect the chip to the Printed Circuit Board (PCB), enabling high-density connections and reliable electrical links. Typically composed…

Read more
ABF Substrate

2024-01-22 Company News / News / Notification / Trade News

What is ABF Substrate? ABF Substrate,ABF Substrate (Anisotropic Conductive Film Substrate) is a critical component for integrated circuit packaging, featuring anisotropic conductive film properties. It provides electrical connections in both vertical and horizontal directions via fine conductive particles, enabling high-density, high-performance packaging. Typically composed of multiple layers of thin films…

Read more
FCBGA Packaging

2024-01-19 Company News / News / Notification / Trade News

What Is FCBGA Packaging? FCBGA Packaging,FCBGA Packaging (Fine-pitch Ball Grid Array) revolutionizes integrated circuit packaging with its fine-pitch solder ball array, enabling high-density connections. This innovative packaging technique enhances signal transmission efficiency and power delivery, crucial for advanced electronics. FCBGA Packaging incorporates multiple layers including insulating, metal, and conductor layers,…

Read more
FCBGA Package

2024-01-18 Company News / News / Notification / Trade News

What is FCBGA Package? FCBGA Package,FCBGA Package (Fine-pitch Ball Grid Array) is an advanced integrated circuit packaging technology, featuring a fine-pitch array of solder balls for high-density connections. This packaging solution facilitates direct chip-to-board connections, optimizing signal transmission and power distribution. FCBGA Packages are constructed with multiple layers including insulating,…

Read more
FCBGA Substrates

2024-01-17 Company News / News / Notification / Trade News

What are FCBGA Substrates? FCBGA Substrates,FCBGA Substrates (Fine-pitch Ball Grid Array) are advanced packaging solutions for integrated circuits, facilitating high-density connections and efficient signal transmission. Utilizing a fine-pitch array of solder balls, FCBGA Substrates enable direct chip-to-board connections, enhancing performance and reliability in electronic devices. Composed of multiple layers including…

Read more

+086 0755 85241496

sales@alcantapcb.com

Leave a message